Study on dynamic recrystallization behavior and microstructure evolution of Cu-Ni-Si-Cr alloy

The flow stress behavior of Cu-Ni-Si-Cr alloy was investigated in the temperature rang from 600°C to 800°C and in the strain rate range from 0.01 s-1 to 5 s-1 on Gleeble-1500D test machine. The relationships between the flow stress strain rate and deformation temperature were studied. The microstructure of the experimental alloy was inspected in the hot-compression procedure. The results show that the dynamic recrystallization is controlled by both strain rate and deformation temperature. The higher the temperature or the less the strain rate, the more easily will take place the dynamic recrystallization. The microstructure depends on the deformation temperature. The hot deformation activation energy of Cu-Ni-Si-Cr alloy during hot deformation is 265.9 kj/mol.