3D CMOS/molecular hybrid circuits.

CMOS/nanowire/nanodevice (CMOL) hybrid circuit(1) promises great opportunities for future hybrid nano-scale integrated circuit implementation. In order to improve the fabrication and performance of CMOL circuits,(2) a novel three dimension (3D) architecture is introduced in this work. 3D CMOL eliminates this special pin requirement, enabling feasible fabrication. Furthermore, each unit in the 3D CMOL doubles the density of nanowires of the original CMOL circuit, while maintaining similar speed/power and fault tolerance performance. The combination of 3D integration and CMOS-nano hybrid circuits shows a great potential for innovation and technology breakthrough.