Millimeter-wave performance of various interconnections used for Si-based IC packaging technologies

Jie Cui,Qidong Wang,Guidotti Mackrides Daniel,Liqiang Cao,Lixi Wan

Electronic Packaging Technology and High Density Packaging（2012）

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摘要

In this paper, we will discuss the mmW performance of ribbon bonding and wire-bonding with different feature sizes and configurations on low temperature co-fired ceramics (LTCC). The impacts of the bonding wire diameter, gap, quantities, and wire loop are also the primary concern. Last but not least, this paper will give readers a comprehensive comparison of mmW performance between different interconnection techniques for the emerging Si-based mmW packaging.

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关键词

integrated circuit interconnections,ic packaging,millimeter-wave performance,low temperature co-fired ceramics,interconnections,ribbon bonding,mmw packaging,integrated circuit packaging,ceramic packaging,millimetre wave circuits,ltcc,wire bonding,lead bonding,millimetre wave integrated circuits

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