Localized Dual-Side Mushroom Ground Plane Structure For The Ssn Suppression In Multi Layer Pcbs

A novel dual-side mushroom ground plane (DMGP) structure is proposed for the noise suppression in high-speed multilayer printed circuit boards (PCBs). The proposed method is localized suppression technique where a dual-side mushroom structure is placed below the noise-sensitive device. In multilayer PCBs with DMGP, noise between two ports with large or small ports spacing can be minimized effectively, which is flexible for the layout of mixed-signal system. Wideband noise suppression is achieved for the fabricated boards even though the port spacing is only 3.5 mm.