Thermal performance of vapor chamber applied for LED cooling

With high thermal conductivity and good temperature uniformity, vapor chamber (VC) becomes one of the most effective technologies to solve the high-power LED thermal problems. In this paper, a combination of experimental and numerical simulation methods is applied to make a study on the heat transfer performance of VC thermal module. In order to provide theoretical guidance for the arrangement of the LED chips, the influence of heat source layouts (centralized and distributed layout) have been discussed in the paper. The results show that the VC thermal module can solve the high-power LED thermal problems effectively.