Adhesion and friction studies of silicon surfaces processed using a microparticle-based method

surface processing method that combines electrostatic deposition of microparticles and dry etching is utilized to modify the surface topography of silicon surfaces to reduce adhesion and friction force. Microscale adhesion and friction tests were conducted on flat (smooth) and processed silicon surfaces with a low elastic modulus thermoplastic rubber (Santoprene) probe that allowed a large enough contact area to observe the feature size effect. Both adhesion and friction force of the processed surfaces were reduced comparing to that of the flat surfaces.