Diffusion Of Dopants And Impurities In Device Structures Of Sic, Sige And Si

Silicon Carbide (SiC) has a high thermal stability and for most elements temperatures in excess of 2000 degreesC are anticipated to reach reasonable diffusivities (greater than or equal to 10(-13) cm(2)/s). We demonstrate, however, that light elements, like hydrogen and lithium, exhibit a considerable mobility already at less than or equal to 400 degreesC, Technologically, the principal interest in these light elements arises because of their ability to electrically passivate shallow acceptors and donors as well as deep level defects in common semiconductors (SiC, Si, GaAs). Indeed, for both hydrogen and lithium the diffusion kinetics is shown to be strongly affected by trapping and de-trapping at boron impurities in the SiC layers. Evidence is also provided that hydrogen migrates as a positively charged ion in p-type SiC. Furthermore, similar to that in crystalline silicon, transient enhanced diffusion of ion-implanted boron is observed in SiC. The initial boron diffusivity during postimplant annealing at 1600 degreesC is enhanced by more than two orders of magnitude compared to equilibrium conditions.For Silicon Germanium (SiGe) diffusion of the n-type dopants Sb and P is studied. Comparing results from strained and relaxed SiGe layers annealed under inert and oxidizing conditions it is unambiguously shown that the diffusion of Sb is almost exclusively mediated by vacancies. On the other hand, P diffusion is predominantly assisted by Si self-interstitials and in this case compositional and strain effects in the SiGe layers are competing.