Wafer Backside Cleaning by Twin-Fluid Flow Cleaning

In the LSI manufacturing, the cleaning of particles adhered to wafer backside has important influence on yield. The particle contamination by wafer transfer and the cleaning evaluation of the particles on the wafer backside are considered. We found that the particle contamination didn't exist the wafer backside by the mechanical transfer, the particle cleaning efficiency of twin-fluid flow cleaning is the medium between the roll brush scrubber cleaning and the disk brush scrubber cleaning.