Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

IEEE Transactions on Microwave Theory and Techniques(2009)

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摘要
This paper presents novel modeling methods for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. The new modeling methods address two open problems related to the modal expansion with the T-matrix method for the analysis of via coupling. First, a novel boundary modeling method, called the frequency-dependent cylinder layer (FDCL), ...
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关键词
Electronics packaging,Electromagnetic scattering,Electromagnetic propagation,Electromagnetic waveguides,Magnetic analysis,Frequency,Coupling circuits,Printed circuits,Power transmission,Circuit noise
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