Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method

In this paper, diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method. The physical property measurement system (PPMS) was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of 100–350 K, and a scanning electron microscope (SEM) was utilized to analyze the microstructure and fracture appearance of the materials. The research indicates that the thermal conductivity of diamond/Cu composite within the range of 100–350 K is 2.5–3.0 times that of the existing MoCu material, and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature. If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements, favorable interfacial adhesion, relatively high interfacial thermal conductivity, and favorable low-temperature heat conduction characteristics would be apparent.