Virtual probe: A statistically optimal framework for minimum-cost silicon characterization of nanoscale integrated circuits.
ICCAD '09: The International Conference on Computer-Aided Design San Jose California November, 2009(2009)
摘要
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die variations in nanoscale manufacturing process. VP exploits recent breakthroughs in compressed sensing [15]--[17] to accurately predict spatial variations from an exceptionally small set of measurement data, thereby reducing the cost of silicon characterization. By exploring the underlying sparse structure in (spatial) frequency domain, VP achieves substantially lower sampling frequency than the well-known (spatial) Nyquist rate. In addition, VP is formulated as a linear programming problem and, therefore, can be solved both robustly and efficiently. Our industrial measurement data demonstrate that by testing the delay of just 50 chips on a wafer, VP accurately predicts the delay of the other 219 chips on the same wafer. In this example, VP reduces the estimation error by up to 10x compared to other traditional methods.
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关键词
Nyquist criterion,integrated circuit manufacture,integrated circuit testing,linear programming,probes,silicon,Nyquist rate,Si,estimation error,intra-die variations,linear programming problem,minimum cost silicon characterization,nanoscale integrated circuits,nanoscale manufacturing process,sparse structure,spatial correlation,spatial frequency domain,statistically optimal framework,virtual probe,Characterization,Integrated Circuit,Process Variation,
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