New results on diamond pixel sensors using ATLAS frontend electronics

M Keil,W Adam,E Berdermann,P Bergonzo,W de Boer,F Bogani,E Borchi,A Brambilla,M Bruzzi,C Colledani,J Conway,P D'Angelo,W Dabrowski, P Delpierre,W Dulinski,J Doroshenko,M Doucet,B van Eijk,A Fallou,P Fischer,F Fizzotti,D Kania,K.K Gan,E Grigoriev,G Hallewell,S Han,F Hartjes, J Hrubec,D Husson,H Kagan,J Kaplon, R Kass,K.T Knöpfle,T Koeth,M Krammer,A Logiudice,L mac Lynne,C Manfredotti,D Meier,D Menichelli,S Meuser,M Mishina, L Moroni,J Noomen,A Oh,L.S Pan, M Pernicka,L Perera,J.L Riester,S Roe,A Rudge,J Russ, S Sala,M Sampietro, S Schnetzer,S Sciortino,H Stelzer,R Stone,B Suter, W Trischuk,D Tromson,E Vittone,P Weilhammer, N Wermes, M Wetstein, W Zeuner,M Zoeller

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment（2003）

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摘要

Diamond is a promising sensor material for future collider experiments due to its radiation hardness. Diamond pixel sensors have been bump bonded to an ATLAS pixel readout chip using PbSn solder bumps. Single chip devices have been characterised by lab measurements and in a high-energy pion beam at CERN. Results on charge collection, spatial resolution, efficiency and the charge carrier lifetime are presented.

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