THE INVESTIGATION OF THERMAL BEHAVIOR ON A THERMAL TEST DIE WITH NON-UNIFORM POWER SOURCES

Thermal behavior a semiconductor chip with non-uniform power sources is investigated. A device which could simultaneously make the power control on twenty heaters and measurement on junction temperatures inside a chip die was developed. Non-uniform power maps on the chip die were further specified to explore the related characterization. The results show that the power distribution appreciably affects the thermal capability of a thermal chip. Local agglomerate power source would tend to form hot spot which will degrade the power limitation of a chip die.