The packaging effect on high g accelerometer test

NEMS(2010)

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摘要
To address the high-g acceleration sensor packaging material and structure selection issue; the modal frequency of different packaging materials was analyzed. According to the natural frequencies, ceramic and stainless steel selected as two package forms. Then, test of the two types of package was processed by Hopkinson bar. The experimental results show that, the sensitivity decreased and the structural stability was good while sensor packaged by stainless steel. The experimental results also show that the sensor has good sensitivity and anti-overload ability. The output single is right when the structure impacted by 150000g. The anti-overload ability was bad of ceramic package structure and easy to produce resonant phenomenon, but sensitivity was higher than the stainless steel packaged sensor.
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关键词
modal frequency,structural stability,natural frequencies,antioverload ability,high-g acceleration sensor packaging material,microsensors,sensor packaging,ceramics,electronics packaging,ceramic package structure,high g acceleration sensor,high g accelerometer test,hopkinson bar,resonant phenomenon,packaging effect,accelerometers,stainless steel,natural frequency,acceleration,sensitivity,packaging
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