Modeling Of Anisotropic Etching In Silicon-Based Sensor Application

SENSORS AND ACTUATORS A-PHYSICAL(1992)

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摘要
Preliminary results of an atomic-scale simulation of the wet-etching process are reported. This model assumes an atomic-etching probability depending on the local surface configuration. The cases of flat Si(100), rough Si(100), and flat Si(111)-oriented surfaces are examined.
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