Nano-Spring Arrays For High Density Interconnect
MICROMACHINED DEVICES AND COMPONENTS VI(2000)
摘要
A new type of compliant interconnect derived from a thin metal film fabricated with a controlled stress profile is being developed for flip-chip interconnects and probing devices. interconnections have been demonstrated on lateral pitches as tight as 6 microns. The interconnect is highly elastic and can provide up to hundreds of microns of vertical compliance.
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关键词
interconnects,packaging,probing,sputtering,thin film,stress
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