Fabrication and Thermal Analysis of Wafer-Level Light-Emitting Diode Packages
Electron Device Letters, IEEE（2008）
摘要
Wafer-level packaged light-emitting diodes (LEDs) are useful for the high-power applications such as back light unit and general solid-state lighting due to the compactness and integrated fabrication process. In this letter, wafer-level packaged LEDs with red, green, and blue multichips were fabricated, and the thermal characteristics of wafer-level packaged LEDs with multichips such as thermal resistance and junction temperature are investigated using both serial and matrix measurement methods.
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关键词
thermal analysis,wafer level packaging,solid-state lighting,thermal resistance,light-emitting diode packages,semiconductor device measurement,lighting,light-emitting diodes (leds),multichip modules,matrix measurement method,junction temperature,wafer-level package,thermal management (packaging),green multichips,wafer-level packaged led,semiconductor device packaging,light emitting diodes,blue multichips,serial measurement method,red multichips,integrated fabrication process,back light unit,temperature measurement,solid state lighting,light emitting diode
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