Pure Tin - The Finish of Choice for Connectors

Pete Elmgren,Dan Dixon, Molex Lisle, Robert Hilty,Thomas Moyer,Sudarshan Lal,Axel Nitsche,Franz Teuber

msra

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摘要
Business conditions in the electronics industry necessitate the reduction and eventual elimination of lead. The tin/lead plating that has been used for decades to promote low cost, solderable, corrosion resistant, and reliable electrical interconnections for connector products will have to be replaced. As lead is eliminated from the plating finish of both current and future products, these properties must be maintained through the proper selection of lead- free plating. This paper will provide the rationale for endorsing pure tin as the finish of choice for connector applications. Tin will be compared to tin/lead with respect to properties and performance. In addition, concerns with the use of pure tin (e.g. tin whiskers) will be addressed.
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