Bubble-Free Wafer Bonding of GaAs and InP on Silicon in a MicrocleanroomVolker Lehmann, Kenichiro Mitani,Reinhard Stengl,Takashi Mii, Ullrich GoseleJAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS（2014）引用 60|浏览2暂无评分关键词bond strength,interface energyAI 理解论文溯源树样例生成溯源树，研究论文发展脉络Chat Paper正在生成论文摘要
