Design and testing of a kinematic package supporting a 32×32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

Innovative approaches to the design and packaging of a high-performance module supporting a 32/spl times/32 array of GaAs multiple quantum-well (MQW) modulators flip-chip bonded to a 9/spl times/9 mm/sup 2/ complementary metal-oxide-semiconductor (CMOS) chip are described. The module integrates a minilens array, a copper heat spreader, a thermoelectric cooler (TEC) and an aluminum heatsink. The mi...