Comparison of wafer-level spatial I/sub DDQ/ estimation methods: NNR versus NCR
DBT '04 Proceedings of the 2004 IEEE International Workshop on Defect Based Testing（2004）
摘要
Extending the useful life of I/sub DDQ/ test to deep submicron technologies has been a topic of interest in recent years. I/sub DDQ/ test loses its effectiveness as the signal to noise ratio degrades due to rising background current and fault-free I/sub DDQ/ variance. Defect detection using I/sub DDQ/ test requires separation of deterministic sources of variation from defective current. Several methods that use deterministic variation in I/sub DDQ/ at the wafer level for estimating fault-free I/sub DDQ/ of a chip are proposed. This paper compares two such methods: nearest neighbor residual (NNR) and neighbor current ratio (NCR). These methods are evaluated using industrial test data for a recent technology.
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关键词
wafer-level spatial,deep submicron technology,recent technology,neighbor current ratio,industrial test data,deterministic source,noise ratio,nearest neighbor,recent year,estimation method,deterministic variation,sub ddq,computer science,logic,degradation,parameter estimation,spatial correlation,chip,signal to noise ratio
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