Direct Electrodeposition Of Copper Ladder Structures On A Silicon Substrate

We report a copper electrodeposition with a microscopic structure of a regular ladder pattern on a silicon substrate where the ladder formation and evolution can be controlled by varying the electric field intensity during the electrodeposition. The deposit morphology varies from a periodic square-island structure to a ladder structure when the applied current is changed. The formation of a ladder structure with nanoparticles is related to the periodic potential measured across the electrodes. This method provides a deep insight into pattern formation in electrodeposition.