Dealing with the heat. Selecting a good thermal interface for reliable chip performance

J. G. Ameen, M. R. Miller, V. P. Yokimcus

IEEE Circuits and Devices Magazine(1998)

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摘要
The need for keeping the package at acceptable temperatures has become a critical issue in recent years. To aid in the cooling of their modules, many electronics manufacturers have implemented the use of heat sinks. Thermal interfaces placed between the package and the heat sink to aid in heat dissipation have become increasingly more important and the demands on these interfaces have increased si...
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关键词
Electronic packaging thermal management,Thermal conductivity,Heat sinks,Circuits,Thermal expansion,Permission,Surface resistance,Copper,Clocks,Thermal stresses
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