A Hybrid Asic And Fpga Architecture

Ps Zuchowski, Cb Reynolds, Rj Grupp, Sg Davis, B Cremen,B Troxel

ICCAD(2002)

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摘要
This paper introduces a new hybrid ASIC/FPGA chip architecture that is being developed in collaboration between IBM and Xilinx, and highlights some of the design challenges this offers for designers and CAD developers. We will review recent data from both the ASIC and FPGA industries, including technology features, and trends in usage and costs. This background data indicates that there are advantages to using standard ASICs and FPGAs for many applications, but technical and financial considerations are increasingly driving the need for a hybrid ASIC/FPGA architecture at specific volume tiers and technology nodes.As we describe the hybrid chip architecture we will point out evolving tool and methodology issues that will need to be addressed to enable customers to effectively design hybrid ASIC/FPGAs. The discussion will highlight specific automation issues in the areas of logic partitioning, logic simulation, verification, timing, layout and test.
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关键词
application specific integrated circuits,circuit CAD,circuit simulation,field programmable gate arrays,formal verification,hybrid integrated circuits,integrated circuit design,integrated circuit economics,integrated circuit modelling,integrated circuit testing,logic CAD,logic partitioning,logic simulation,logic testing,timing,ASIC/FPGA industries technology features/usage/cost trends,CAD tools,IC test,circuit layout,design methodology issues,hybrid ASIC/FPGA chip architecture,logic partitioning,logic simulation,technology nodes,timing,verification,volume tiers,
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