Effective and reliable heat management for power devices exposed to cyclic short overload pulses.

Electric overload situations in automotive truck applications necessitate a particularly efficient and reliable heat management for silicon power devices, especially when repetitive events must be handled. We show by simulations and experiments that a thick copper power metallization is particularly useful for overload pulses in the 10 mu s range, and demonstrate the reliability of this solution. (C) 2013 Elsevier Ltd. All rights reserved.