Impact of technology scaling and packaging on dynamic voltage scaling techniques
ieee（2002）
摘要
This paper studies how the effectiveness of various dynamic voltage scaling mechanisms is affected by technology scaling and system activity. We show that Vdd scaling maintains its effectiveness while Vth scaling and supply gating become more efficient as the feature size decreases. We also discuss the impact of packaging and. provide tools for bringing it early into the design process. In this way, short-term and long-term savings are identified, with the latter providing additional energy savings up to 10.2%, on average.
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关键词
dynamic voltage scaling techniques,thermal analysis,logic simulation,integrated circuit modelling,system activity,leakage currents,design process packaging tools,low-power electronics,thermal management (packaging),supply gating efficiency,feature size decrease,logic design,integrated circuit design,die temperature modeling,integrated circuit packaging,power reduction techniques,dvs effectiveness,dvs technology scaling/packaging impact,short-term/long-term energy savings,leakage-oriented techniques,low power electronics,design process
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