Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology.

Giulia Beanato,Paolo Giovannini,Alessandro Cevrero,Panagiotis Athanasopoulos,Michael Zervas,Yuksel Temiz,Yusuf Leblebici

IEEE Journal on Emerging and Selected Topics in Circuits and Systems（2012）

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摘要

An innovative modular 3-D stacked multi-processor architecture is presented. The platform is composed of completely identical stacked dies connected together by through-silicon-vias (TSVs). Each die features four 32-bit embedded processors and associated memory modules, interconnected by a 3-D network-on-chip (NoC), which can route packets in the vertical direction. Superimposing identical planar ...

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关键词

Through-silicon vias,Program processors,Stacking,Random access memory,Fabrication,Multicore processing,Integrated circuit interconnections

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