Bridging the Interconnection Density Gap for Exascale Computation

Computer（2011）

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摘要

Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs.

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关键词

architectural approach,Three-dimensional silicon interposers,Exascale Computation,interconnection density,Interconnection Density Gap,FR-4 printed circuit board,silicon ICs,monolithic silicon-based design

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