Zhongxiang He

IBM Corp., Essex Junction, VT|c|

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Papers39 papers

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OPTOELECTRONIC STRUCTURES HAVING MULTI-LEVEL OPTICAL WAVEGUIDES AND METHODS OF FORMING THE STRUCTURES

Zhongxiang He, Qizhi Liu, Ronald G Meunier, Steven M Shank

(2015)

Bibtex

Improvements in SOI technology for RF switches

Mark D Jaffe,Michel Aboukhalil,Alan B Botula,John J Ellismonaghan,Jeffrey P Gambino, J Gross,Zhongxiang He,Alvin J Joseph,R D Phelps,Steven M Shank,James A Slinkman,Randy Wolf

Silicon Monolithic Integrated Circuits in RF Systems, pp.30-32, (2015)

EIWOSBibtex

INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE AND RELATED METHOD

Edward C Cooney,Jeffrey P Gambino,Zhongxiang He, Robert K Leidy

(2015)

Bibtex

COMPOSITE COPPER WIRE INTERCONNECT STRUCTURES AND METHODS OF FORMING

Felix P Anderson,Zhongxiang He, Anthony K Stamper

(2014)

Cited by1Bibtex

Interconnect structures and design structures for a radiofrequency integrated circuit

Timothy J Dalton, Ebenezer E Eshun, Sarah L Grunow,Zhongxiang He, Anthony K Stamper

(2014)

Cited by1Bibtex

Thick On-Chip High-Performance Wiring Structures

Edward C Cooney,Jeffrey P Gambino,Zhongxiang He, T C Lee, Xiao Hu Liu

(2014)

Bibtex

Isolated wire structures with reduced stress, methods of manufacturing and design structures

Jeffrey P Gambino,Zhongxiang He, T C Lee

(2014)

Bibtex

Integrated circuit including sensor structure, related method and design structure

Edward C Cooney,Jeffrey P Gambino,Zhongxiang He, T C Lee

(2014)

Cited by1Bibtex

Tapered via and MIM capacitor

James S Dunn,Zhongxiang He, Anthony K Stamper

(2014)

Bibtex

INDUCTORS AND WIRING STRUCTURES FABRICATED WITH LIMITED WIRING MATERIAL

Hanyi Ding,Jeffrey P Gambino,Zhongxiang He,Alvin J Joseph, Anthony K Stamper, Timothy D Sullivan

(2013)

Cited by2Bibtex

TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION

Gregory S Chrisman,Edward C Cooney, Jeffrey P Gambino,Zhongxiang He, Thomas L Mcdevitt, Eva A Shah

(2013)

Bibtex

Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors

James S Dunn,Zhongxiang He, Anthony K Stamper

(2013)

Cited by1Bibtex

METHOD OF ELECTROLYTIC PLATING AND SEMICONDUCTOR DEVICE FABRICATION

Felix P Anderson,Zhongxiang He, Anthony K Stamper, Eric J White

(2012)

Cited by2Bibtex

Interconnect structures, methods for fabricating interconnect structures, and design structures for a radiofrequency integrated circuit

Timothy J Dalton, Ebenezer E Eshun, Sarah L Grunow,Zhongxiang He, Anthony K Stamper

(2012)

Cited by4Bibtex

METHOD FOR MANAGING CIRCUIT RELIABILITY

Fen Chen, Kai D Feng,Zhongxiang He

(2012)

Bibtex

Semiconductor structure including a high performance fet and a high voltage fet on an SOI substrate

Hanyi Ding, Kai D Feng,Zhongxiang He, Zhenrong Jin,Xuefeng Liu, Yun Shi

(2012)

Cited by2Bibtex

INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME

David A Demuynck,Zhongxiang He, D R Miga, Matthew D Moon, Daniel S Vanslette, Eric J White

(2012)

Cited by1Bibtex

SEMICONDUCTOR SWITCHING DEVICE EMPLOYING A QUANTUM DOT STRUCTURE

Zhongxiang He, Qizhi Liu

(2012)

Bibtex

Planar MEMS RF capacitor integration

Anthony K Stamper,Christopher V Jahnes,Sandra R Dupuis,A K Gupta,Z X He,Russell T Herrin, Stephen E Luce, Jeffrey C Maling, D R Miga,William J Murphy, E J White,Shawn J Cunningham

Solid-State Sensors, Actuators and Microsystems Conference, pp.1803-1806, (2011)

EIWOSBibtex

COMPLIMENTARY METAL-INSULATOR-METAL (MIM) CAPACITORS AND METHOD OF MANUFACTURE

James S Dunn,Zhongxiang He, Anthony K Stamper

(2011)

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Zhongxiang HeBinding

Papers39 papers

Zhongxiang He