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个人简介
Yaoru Hou (Student Member, IEEE) received the B.S. degree from Southeast University, Nanjing, China, in 2020. He is currently working toward the M.S. degree of integrated circuit design with the National Engineering Research Center for ASIC, Southeast University. In 2020, he participated in tape-out of a 2Mb computing-in-memory STT-MRAM chip. He is currently working on design and technology co-optimization for high yield MRAM. His research interests include device modeling, memory circuit design and in-MRAM computing.
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Yaoru Hou,Kaifeng Wang, Chenxing Liu-Sun, Jianfeng Hang,Xinfang Tong,Chunyu Peng,Yongqin Wu,Ye Ren,Weihai Bu,Xin Si,Bo Liu,Xiulong Wu,
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
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ISSCCpp.500-501, (2023)
IEEE Design & Test of Computersno. 3 (2021): 1-1
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