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Xiaoqian Li (Member, IEEE) received the B.S. degree in materials science and engineering from Xi'an Jiaotong University, Xi'an, China, in 2007 and the Ph.D. degree in materials science and engineering from Arizona State University, Tempe, AZ, USA, in 2011. From 2011 to 2013, she was a Postdoctoral Researcher with Arizona State University. Her research interests include the dealloying of silver or gold alloy nanoparticles, and structural and mechanical characterization of porous gold. From 2013 to 2017, she was a Packaging Process Engineer with Intel working on mold and ball attach process development. Since 2017, she has been a Packaging Integration Engineer with Intel Corp., Chandler, AZ, USA. She is the author of nine published articles and 20 patents.
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论文共 3 篇作者统计合作学者相似作者
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Ravi Mahajan,Xiaoqian Li, Joshua Fryman,Zhichao Zhang,Srikant Nekkanty,Pooya Tadayon,James Jaussi,Sergey Shumarayev,Ankur Agrawal, Susheel Jadhav,Kumar Abhishek Singh,Andrew Alduino,
Kaveh Hosseini,Edwin Kok,Sergey Y. Shumarayev,Chia-Pin Chiu,Arnab Sarkar,Asako Toda, Yanjing Ke,Allen Chan,Daniel Jeong,Mason Zhang, Sangeeta Raman,Thungoc Tran,
2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)pp.1-3, (2021)
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