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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 24 篇作者统计合作学者相似作者

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Impact of Thermal Annealing and Other Process Parameters on Hybrid Bonding Performance for 3D Advanced Assembly Technology
Taiwo Ajayi, Alvin Gatimu,Xavier F. Brun, Chris Woods,Kay Song, Abhishek Bhat, Charudatta Galande, Phillip Le,Zia Karim
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1426-1432, (2023)
引用0浏览0EIWOS引用
0
0
Controlling Underfill on Die in Multichip Heterogenous Integration With Large Die Height Delta
Ziyin Lin, Wei Li,Edvin Cetegen, Yang Guo,Nai-Yuan Liu, Ifeanyi Okafor,Vipul Mehta,Xavier Brun, Shan Zhong, Hsin-Yu Li, Christopher Rumer
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2023): 1510-1515
引用0浏览0EIWOS引用
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Characterization of 300 mm Low Temperature SiCN PVD Films for Hybrid Bonding application
Xavier F. Brun, Md M. Hasan,Yi Yang,Patrik Carazzetti,Carl Drechsel,Ewald Strolz
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.548-555, (2023)
引用2浏览0EIWOS引用
2
0
Critical Dimension Scatterometry as a Scalable Solution for Hybrid Bonding Pad Recess Metrology
Haris Khan Niazi, Botao Zhang,Xavier F. Brun,Shankar Krishnan, James Chuang
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1403-1409, (2023)
引用0浏览0EIWOS引用
0
0
Ultra-thin mold cap for Advanced Packaging Technology
N. Deb,X. F. Brun,C. Masuyama, N. Hamada, Y. Hirano, K. Wada, H. Oshida, K. Ganbayashi, L. L. Zhou, T. Y. Lu
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.43-49, (2022)
引用2浏览0EIWOS引用
2
0
Selective and Tunable Slurry for Advanced Packaging Epoxy Mold Compound
Shogo Arata, Chiaki Noda, Yasuhiro Ichige, Satoyuki Nomura, T. S. Widodo, N. Tsunoda,X. F. Brun
2022 IEEE International Interconnect Technology Conference (IITC)pp.87-89, (2022)
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300mm Full Thickness Si-Based IC Singulation Using Plasma Dicing for Advanced Packaging Technologies
R. Surapaneni, B. S. Hamlin, J. Chiu,X. F. Brun,R. Barnett, M. Muggeridge, H. Bhasker, N. Richards
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1019-1024, (2022)
引用2浏览0EIWOS引用
2
0
Selective Epoxy Mold Compound Slurry for Advanced Packaging Technology
T. S. Widodo,X. F. Brun, N. Tsunoda, Y. Ichige, S. Arata, C. Noda, S. Nomura, S. Kondo
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1271-1276, (2022)
引用1浏览0EIWOS引用
1
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Enabling Next Generation 3D Heterogeneous Integration Architectures on Intel Process
A. Elsherbini, K. Jun, S. Liff, T. Talukdar, J. Bielefeld,W. Li, R. Vreeland, H. Niazi, B. Rawlings,T. Ajayi, N. Tsunoda, T. Hoff,
2022 INTERNATIONAL ELECTRON DEVICES MEETING, IEDMpp.27.3.1-27.3.4, (2022)
引用4浏览0EIWOS引用
4
0
Investigation of Low Stress and Low Temperature SiN and SiCN PVD Films for Advanced Packaging Applications
Brun F. Xavier, Carazetti Patrick,Strolz Ewald
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.2111-2117, (2021)
引用2浏览0EIWOS引用
2
0
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