Wei Wu(武伟)

Wei Wu received the B.E. degree in engineering mechanics from the North University of China, Taiyuan, China, in 2008. He is currently pursuing the Ph.D. degree in mechanics with the Beijing University of Technology, Beijing, China. His current research interests include reliability of materials and structure in the field of advanced electronic packaging, including the thermal and mechanical modeling, package reliability, 3-D integration technology, and mechanical characterization of materials.