His responsibility is the electrical system packaging architecture of IBM Systems including the design of high-speed channels to enable the computer system performance and the power distribution networks for reliable operation of the integrated circuits that make up the processor subsystem.,Dr. Becker has chaired the IEEE EPEPS Conference and the SIPI Embedded Conference of the EMC Symposium. He currently chairs the IEEE EPS Technical Committee on electrical modeling, design, and simulation and is a Senior Area Editor for the IEEE Transactions on Components, Packaging and Manufacturing Technology. He is a Cochair of the High-Performance Computing Working Group of the Heterogeneous Integration Roadmap. He has chaired the iNEMI PEG on high-end systems including the chapter on the high-end systems roadmap. He is an iNEMI Technical Committee member and a member of SWE.