Wei-Tsu Tseng

Wei-Tsu Tseng (M'97) received the B.S. degree from the National Cheng Kung University of Tainan, Tainan, Taiwan, and the M.S. and Ph.D. degrees in physics from the University of Texas at Austin, TX, USA. He was a research staff member with the National Nano Device Laboratories, Hsinchu, Taiwan, and then became an Assistant Professor with Cheng Kung University before joining the IBM Semiconductor Research and Development Center (SRDC), NY, USA, in 2001. He is currently engaged in Cu CMP process development for 22 nm and 14 nm in IBM-SRDC. He has over 30 U.S. patents to his credit. He has authored and co-authored more than 70 technical papers in journals and conferences. His research has been focused on semiconductor unit processes and integration including low-$k$ dielectric material characterization, Cu CMP process modeling, CMP slurry process development, post-CMP cleaning, and defect reduction. Dr. Tseng is a member of ECS.