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论文共 58 篇作者统计合作学者相似作者
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International Symposium for Testing and Failure Analysis ISTFA 2022: Conference Proceedings from the 48th International Symposium for Testing and Failure Analysis (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2020): 1425-1426
International Symposium for Testing and Failure AnalysisISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis (2020)
Wentao Qin, Dorai Iyer,Jim Steinwall,George Chang,Robert Watkins, Carroll Casteel, Jim Morgan,Mike Thomason
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2020): 1587-1588
T. Pinili, R. Manolo, A. Denoyo, B. Yabut, D. Moore, B. Cowell, J. Jenson, K. Truong,Jeff Gambino, R. Watkins,W. Qin, G. Brizar,
Wentao Qin,Scott Donaldson,Dan Rogers, Lahcen Boukhanfra, Julien Thiefain,Denise Barrientos,Gordy Grivna, Jim Steinwall,George Chang,Jeff Gambino
International Symposium for Testing and Failure AnalysisISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysispp.121-127, (2018)
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