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个人简介
Vikas Chauhan (Senior Member, IEEE) received the B.E. degree (Hons.) in electrical and electronics engineering from the Birla Institute of Technology and Science, Pilani, India, in 2012, and the M.S. and Ph.D. degrees in electrical and computer engineering from North Carolina State University, Raleigh, NC, USA, in 2014 and 2019, respectively.
He was an Intern with Qualcomm Corporation Research and Development, San Diego, CA, USA, in summer 2017, and the imec USA Nanoelectronics Design Center, Kissimmee, FL, USA, in spring 2019, where he worked on millimeter-wave integrated circuit design. In 2019, he joined the imec USA Nanoelectronics Design Center, where he is currently a Researcher. His research interests include RF and millimeter-wave integrated circuit design, and imaging system design.
Dr. Chauhan was a recipient of the Best Student Paper Award (Third Place) at the Global Symposium on Millimeter Waves, Boulder, CO, USA, in 2018.
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IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERSno. 11 (2022): 1315-1318
N. Collaert,A. Alian, A. Banerjee, G. Boccardi,P. Cardinael,V. Chauhan,C. Desset,R. ElKashlan, A. Khaled, M. Ingels, B. Kunert, Y. Mols,
IEEE Transactions on Microwave Theory and Techniquesno. 11 (2021): 4856-4868
Nadine Collaert,AliReza Alian,Aritra Banerjee,Vikas Chauhan,Rana Y. ElKashlan, Brent Hsu,Mark Ingels,Ahmad Khaled, Komal Vondkar Kodandarama,Bernardette Kunert,Yves Mols,Uthayasankaran Peralagu,
ECS Meeting Abstractsno. 24 (2020): 1707-1707
N. Collaert,A. Alian,A. Banerjee,V. Chauhan,R. Y. ElKashlan,B. Hsu, M. Ingels,A. Khaled, K. Vondkar Kodandarama, B. Kunert,Y. Mols,U. Peralagu,
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