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论文共 24 篇作者统计合作学者相似作者
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Channing Cheng-Lin Yang,John H. Lau, Andy Yan-Jia Peng, Vincent Teng,Gary Chang-Fu Chen, Jones Yu-Cheng Huang,Y. H. Chen,Hsing-Ning Liu,Tzyy-Jang Tseng,Ming Li
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.542-547, (2023)
John H. Lau,Curry Lin,Hsing-Ning Liu,Kai-Ming Yang,Tim Xia,Cheng-Ta Ko,Bruce Puru Lin, Yu-Ling Chuang,R. Chen, M. Ma,Tzyy-Jang Tseng,Ming Li,
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2023): 1371-1379
Channing Cheng-Lin Yang,John H. Lau, Gary Chang-Fu Chen, Joe Huang, Andy Peng,Hsing-Ning Liu,Y-H. Chen,Tzyy-Jang Tseng
IMAPS symposia and conferencesno. Issue 1 (2023)
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Gary Chang-Fu Chen,John H. Lau, Channing Cheng-Lin Yang, Jones Yu-Cheng Huang, Andy Yan-Jia Peng,Hsing-Ning Liu,Tzyy-Jang Tseng,Ming Li
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.30-37, (2022)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2022): 469-478
Ricky Tsun-Sheng Chou,John H. Lau,Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang,Hsing-Ning Liu,Tzyy-Jang Tseng
Journal of Microelectronics and Electronic Packagingno. 1 (2022): 8-17
International Symposium on Microelectronicsno. 1 (2021): 000217-000223
John H. Lau,Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Ricky Tsun-Sheng Chou, Channing Cheng-Lin Yang,Hsing-Ning Liu,Tzyy-Jang Tseng
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 8 (2021): 1301-1309
Ricky Tsun-Sheng Chou,John H Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang,Hsing-Ning Liu,Tzyy-Jang Tseng
International Symposium on Microelectronicsno. 1 (2021): 000124-000129
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