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Tong-Hong Lin (Student Member, IEEE) received the B.S.E.E. and M.S. degrees in communication engineering from National Taiwan University, Taipei, Taiwan, in 2011 and 2013, respectively, and the M.S. degree in computational science and engineering from the Georgia Institute of Technology, Atlanta, GA, USA, in 2020, where he is currently pursuing the Ph.D. degree in electrical and computer engineering.
He is currently a Research Assistant with the ATHENA Group and 3D Systems Packaging Research Center, Georgia Institute of Technology. His current research interests include the characterization of inkjet printing and 3-D printing material properties and fabrication processes, application of additive manufacturing technologies to wearable and flexible electronics, radio frequency (RF) energy-harvesting systems, wireless power transfer systems, wireless sensing networks, antenna-in-package design, RF/millimeter-wave (mm-wave) packaging design, 5G system-on-package modules, and glass packaging design.
Mr. Lin was a recipient of the Student Travel Award of the 2018 IEEE Electronic Components and Technology Conference (ECTC).
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Antenna and Sensor Technologies in Modern Medical Applicationspp.399-434, (2021)
Antenna‐in‐Package Technology and Applicationspp.267-291, (2020)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2020): 1515-1523
2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G)pp.1-3, (2019)
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