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Papers共 64 篇Author StatisticsCo-AuthorSimilar Experts

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Exploring Efficient Thermal Management Solutions for Backside Power Delivery Network (BSPDN) Systems Using Multi-Scale Modeling
Feifan Xie,Tiwei Wei
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2025): 1-1
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Reliability and Microstructure Characterization of Through-Silicon Vias (TSV) at Different Aspect Ratios Using EBSD-Raman Spectroscopy
Shuhang Lyu, Thomas Beechem,Tiwei Wei
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.380-385, (2025)
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Bottom-Up Electrodeposition of Small Diameter, High Aspect Ratio Nanotwinned-Copper-Filled Through-Silicon Vias for Ultra High-Density 3D Integration
Yuchen Bao, Shuhang Lyu,Tiwei Wei
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.1-5, (2025)
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Development of Straight, Small-Diameter, High-Aspect Ratio Copper-Filled Through-Glass Vias (TGV) for High-Density 3D Interconnections
Ye Yang, James Chien, Shuhang Lyu,Tiwei Wei
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.1036-1042, (2025)
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Process Development and Characteristics of Small-Diameter (<3 Μm), Cobalt-Filled Through Silicon Vias (tsvs) for High-Density 3D Chip Stacking
Xinyi Zhang, Shuhang Lyu, Thomas E. Beechem,Tiwei Wei
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.1290-1295, (2025)
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Direct-On-Chip Two-Phase Microjet Cooling with Surface-Enhanced Electrodeposited Microporous Structures
Keyu Wang, Ketankumar Jayantkumar Yogi, Gopinath Sahu, Aaron Du,Tiwei Wei
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.2300-2306, (2025)
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Inter-Die Hybrid Cu/Diamond Microbump Bonding for 3D Heterogenous Integration
Zhengwei Chen, Shusmitha Kyatam, Keyu Wang, Noah Opondo, Miguel A. Neto,Ricardo Oliveira, Jie Li, Joana Catarina Mendes,Tiwei Wei
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.351-356, (2025)
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A Novel Thermal Isolation Method with Embedded ‘glass Bridge’ Structures in Silicon-Based 2.5D Heterogeneous Integration Systems
Zhengwei Chen, Zixin Xiong, Keyu Wang, Amy M. Marconnet,Tiwei Wei
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.895-901, (2025)
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First Demonstration of Metal-Lidded Integral Microjet Impingement On-Chip Cooling Structures with Alternating Feeding and Draining Nozzles for High-Performance Interposer Packages
Gopinath Sahu, Duc Hoang, Ruoyi Li, Akshat Hetal Patel, Ketan Yogi,Tiwei Wei
2025 IEEE 75th Electronic Components and Technology Conference (ECTC)pp.499-504, (2025)
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Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers
Ye Yang, Kelly E Lahaie,Tiwei Wei
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2025): 1-1
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Author Statistics

#Papers: 56

#Citation: 414

H-Index: 13

G-Index: 19

Sociability: 5

Diversity: 2

Activity: 6

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