T.-M. Winkel

Thomas-Michael Winkel IBM Systems and Technology Group, IBM Deutschland Research and Development GmbH, Schoenaicherstrasse 220, 71032 Boeblingen, Germany (winkel@de.ibm.com). Dr. Winkel is currently an Advisory Engineer and the technical lead for the z10 midrange systems. He received both his diploma and his Ph.D. degree in electrical engineering from the University of Hannover, Germany. His current focus is the electrical packaging design with respect to signal integrity, power integrity, and system aspects. He has authored or coauthored more than 20 conference and journal papers and holds 10 patents. He is the general co-chairman of the IEEE European Systems Packaging Workshop 2009 and a technical program committee member of the Electrical Performance on Electronic Packaging and the Signal Propagation on Interconnects Workshops.