Chrome Extension
WeChat Mini Program
Use on ChatGLM
VIPCreated with Sketch.
Research Interests

Papers共 10 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding with Tailored CMP Process
Ou-Hsiang Lee,Wei-Lan Chiu,Hsiang-Hung Chang,Chia-Wen Chiang, Shih-cheng Yu,Tsung-Yu Ou Yang, Su-Ching Hsiao,Ting-Yu Ko,Yu-Min Lin,Chin-Hung Wang,Wei-Chung Lo,Chia-Hsin Lee, Chung-An Tang,Michelle Fowler, Maycic Lubbers
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1863-1867, (2024)
Cited0Views0EIWOSBibtex
0
0
Pre-fabricated Via Array Substrate for Programmable AIoT Applications
T. Y. Ouyang, Y. P. Chan, H. C. Fu, H. H. Chang
2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.393-396, (2024)
Cited0Views0EIWOSBibtex
0
0
A Novel Polymer-Based Ultra-High Density Bonding Interconnection
Yu-Min Lin,Tsung-Yu Ou Yang,Ou-Hsiang Lee,Ching-Kuan Lee, Hsiu-Kuei Ko, Yi-Shu Chen,Hsiang-Hung Chang,Michael Gallagher,Christopher Gilmore, Po-Yao Chuang, Ying-Chung Tseng,Po-Hao Tsai, Po-Chun Huang,Chang-Chun Lee
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1779-1784, (2023)
Cited1Views0EIWOSBibtex
1
0
Fan-out Wafer-level Packaging Process Integration for Artificial Intelligence Real Dies
T. Y. Ouyang, O. Y. Xiovo,R. S. Cheng, Y. S. Chang,T. Y. Hung, C. K. Lee, Y. M. Lin
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.290-293, (2023)
Cited0Views0EIWOSBibtex
0
0
Pre-fabricated High-density TSV Interposer for Programmable IC Applications
T. Y. Ouyang,Y. T. Hung,O. H. Lee, S. Y. Li, W. L. Chiu,T. Y. Hung, S. H. Wu,H. H. Chang
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.1-4, (2022)
Cited0Views0EIWOSBibtex
0
0
Polymer Direct Bonding Characterization in Wafer Level Packaging for 3D Integration
T. Y. Ou-Yang, C. C. Hsiao,O. H. Lee,C. W. Chiang,H. C. Fu, W. H. Lin,H. H. Chang
2021 16TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)pp.173-176, (2021)
Cited0Views0EIWOSBibtex
0
0
Author Statistics

#Papers: 10

#Citation: 23

H-Index: 2

G-Index: 4

Sociability: 3

Diversity: 1

Activity: 0

  • 合作者
  • 学生
  • 导师
No result temporarily, you can search similar Scholar with the same research interest
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn