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Xinglin Sun (Member, IEEE) received the Ph.D. degree in instrument science and technology from Zhejiang University, Hangzhou, China, in 2019.
From 2016 to 2018, he was a Visiting Scholar with the Electromagnetic Compatibility Laboratory, Missouri University of Science and Technology, Rolla, MO, USA. In August 2019, he joined the Zhejiang University, where he is currently an Assistant Professor with the College of Biomedical Engineering and Instrument Science. He has published over 20 articles and holds seven granted patents. His current research interests include high-performance circuit systems, signal and power integrity, and precision photoelectric sensors and instruments.
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IEEE Sensors Journalno. 99 (2024): 1-1
IEEE Trans. Instrum. Meas. (2023): 1-11
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2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)pp.495-498, (2022)
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