Sumanth Kumar Pavuluri

Sumanth K. Pavuluri received the B.Tech. degree in electronics and communications engineering from Jawaharlal Nehru Technological University, Hyderabad, India, the M.Sc. degree in microsystems engineering from Heriot-Watt University, Edinburgh, U.K., and the Ph.D. degree from Heriot-Watt University, in 2004, 2005, and 2011, respectively. After completing his Ph.D. in 2011 on micro machined antennas. He joined Heriot-Watt University, where he is currently a Postdoctoral Research Associate. In 2008, he worked on highly sensitive micro machined microwave sensors for biological and chemical material detection based on waveguides loaded with a frequency selective surface. This work was a finalist in IEEE Microwave Theory and Techniques (MTT) Microwave Measurement Competition in 2009. He also worked on the Frequency Agile Microwave Oven Bonding System (FAMOBS) from February 2009 to October 2011 and developed patentable new generation open-ended oven prototypes for uniform and efficient curing of microwave chips. This project work reached a technology readiness level of 5. He also worked on commercial automated remote sensing devices for road surfaces in 2012. After working on a Scottish Enterprise high growth spin out project on a patented sensor system product for reducing wastage in the food & drink industries from 2015 to middle of 2017, he successfully spun-out a company, MicroSense Technologies Limited, along with Prof. Marc Desmulliez. MicroSense was the 2016 winner of the Converge Challenge, the Scottish company creation competition, and was commended in 2018 with an IET Innovation Award. MicroSense has also featured recently in January 2019 in BBC showcasing a new product development from the company. In 2017 and 2018, he was a Member of the Heriot-Watt Group in the EPSRC-funded project Sonopill, working on the electronics design and packaging of ingestible medical devices that are for various exploratory sensor systems for integration into capsules. His current research interests include medical diagnostics, medical electronics including telemetry and packaging, novel micro fabrication, micromachining methods for RF and acoustic devices for bio medical applications, microwave sensing, curing, and integrated circuit packaging.