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Throughout his career at IBM, Steve and his colleagues have expanded the capabilities of sputter deposition to meet the challenges of the ever-more demanding integrated circuit technology roadmap. The team, initially focused on magnetrons, pioneered developments related to gas rarefaction, plasma impedance, sputtered atom transport, and very low-pressure sputtering. From these areas came the inventions of hollow-cathode enhancement, collimated deposition, and ionized PVD; the latter two are now used broadly across the semiconductor manufacturing world. In later work, they developed plasma-enhanced atomic layer deposition for semiconductor applications with a primary focus on interconnect applications. Key research was done on the microstructure and interfaces of Cu and W features to control resistivity at and below the electron-scattering scale. Steve’s other investigations spanned a broad range of topics from novel semiconductor devices and nanopore-based DNA microfluidic devices, to the application of plasma-based deposition processes for quantum computing (qubit formation). In total, Steve’s innovations have led to numerous awards at IBM, while contributing to over 80 patents, as registered by USPTO.
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JOURNAL OF VACUUM SCIENCE & TECHNOLOGY Ano. 6 (2020)
Handbook of Semiconductor Manufacturing Technologypp.15-1, (2017)
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