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职业迁徙
个人简介
Her expertise is in developing customized simulations for a variety of engineering applications. Current projects include thermal management of electronic packaging in fixed-wing, UAV and space vehicles; as well as modeling and simulation of biomechanical systems. She has received support for her research from NSF, NIH, NASA, DOD and industry.
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论文共 9 篇作者统计合作学者相似作者
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2022 IEEE/AIAA TRANSPORTATION ELECTRIFICATION CONFERENCE AND ELECTRIC AIRCRAFT TECHNOLOGIES SYMPOSIUM (ITEC+EATS 2022)pp.1159-1162, (2022)
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2022)
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PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019 (2020)
Kirsten Lovelace,Sonya Smith
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019 (2020)
ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2020)
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