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排名必读论文期刊顶会热点AI 简史溯源树小脉星探人才迁徙塔尖人才国防情报追踪开源工具智慧手语
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论文共 58 篇作者统计合作学者相似作者

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Memory Window in Si:HfO2 FeRAM arrays: Performance Improvement and Extrapolation at Advanced Nodes
J. Laguerre,M. Bocquet, O. Billoint,S. Martin, J. Coignus, C. Carabasse, T. Magis, T. Dewolf, F. Andrieu, L. Grenouillet
2023 IEEE International Memory Workshop (IMW)pp.1-4, (2023)
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Reliability assessment of hafnia-based ferroelectric devices and arrays for memory and AI applications (Invited)
Laurent Grenouillet,Justine Barbot, J. Laguerre,Simon Martin,Catherine Carabasse, M. Louro, Messaoud Bedjaoui, S. Minoret, S. Kerdilès, C. Boixaderas, T. Magis,Carine Jahan,
IRPSpp.1-8, (2023)
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Synergetic FeRAM/OxRAM memory array operation induced by oxygen vacancy interface engineering in Si:HfO2 ferroelectric films
Laurent Grenouillet,Simon Martin, Julie Laguerre, Justine Barbot,Nicolas Vaxelaire,Pierre-Marie Deleuze,Olivier Renault, Rabah Kies, Catherine Carabasse, Pattamon Dezest,Francois Aussenac, Richard Souil,
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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Multi Level Cell Reliability in Ge-rich GeSbTe-based Phase Change Memory Arrays
V. Meli, G. Navarro, J. Rottner, N. Castellani,S. Martin, N. P. Tran, G. Bourgeois, C. Sabbione, M. C. Cyrille
2023 IEEE International Reliability Physics Symposium (IRPS)pp.1-5, (2023)
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Integration of HfO2-based 3D OxRAM with GAA stacked-nanosheet transistor for high-density embedded memory
T. Dubreuil, S. Barraud, J. -M. Pedini,J. -M. Hartmann, F. Boulard, A. Sarrazin, A. Gharbi, J. Sturm, A. Lambert,S. Martin, N. Castellani, A. Anotta,
IEEE 53RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, ESSDERC 2023pp.117-120, (2023)
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Fabrication of Low-Power RRAM for Stateful Hyperdimensional Computing
T. Dubreuil,S. Barraud, B. Previtali, S. Martinie, J. Lacord,S. Martin, N. Castellani, A. Anotta,F. Andrieu
2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)pp.1-2, (2023)
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Integration of HfO2-based 3D OxRAM with GAA stacked-nanosheet transistor for high-density embedded memory
T. Dubreuil, S. Barraud, J.-M. Pedini,J.-M. Hartmann, F. Boulard, A. Sarrazin, A. Gharbi, J. Sturm, A. Lambert,S. Martin, N. Castellani, A. Anotta,
ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)pp.117-120, (2023)
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