基本信息
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个人简介
Siddharth Ravichandran received his bachelor’s in electrical engineering from the College of Engineering, Guindy, Chennai, India, in 2013, and the master’s degree in electrical and computer engineering from Rutgers University, New Brunswick, NJ, USA, in 2016. He is currently pursuing the Ph.D. degree in electrical engineering with the 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA.
His current research interests include signal and power integrity design and analysis of 2.5-D/3-D packaging architectures for heterogeneous integration.
研究兴趣
论文共 25 篇作者统计合作学者相似作者
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IEEE Nanotechnology Magazineno. 2 (2024): 21-29
IMAPSource Proceedingsno. DPC (2024)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1114-1120, (2022)
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 3 (2021): 384-394
Proposed for presentation at the Sandia Academic Alliance Spring 2021 Georgia Tech LDRD Virtual Poster Session held March 31, 2021 (2021)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (2021)
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020)pp.1132-1139, (2020)
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作者统计
#Papers: 25
#Citation: 285
H-Index: 11
G-Index: 16
Sociability: 4
Diversity: 1
Activity: 2
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