Si Chen(陈思)

Si Chen received the B.E. degree in materials science from Hohai University, Nanjing, China, in 2011, and the Ph.D. degree from the Beijing University of Technology, Beijing, China, in 2017. Since 2019, she has been a Senior Engineer with the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, China Electronic Product Reliability and Environmental Testing Research Institute. She has published well over 26 papers to journals and international conferences, and hold four patents. Her current research interests are focused on reliability issues of TSV stacking integration.