Shi-Chang Tseng

Shi-Chang Tseng received the Ph.D. degree from the University of Wisconsin–Madison, Madison, in 1993. From 2010 to 2016, he was with the Dean of the College of Engineering, National Yunlin University of Science and Technology (YunTech), Taiwan. Since 2017, he has been the Dean of the Office of International Affairs, YunTech. His recent research focuses on novel technology of micro injection molding. He has developed some creative methods to manufacture micro molds and micro hot runners by LIGA and/or micro machining processes. He has authored the fabrication of micro components, such as optical fiber connectors, optoelectronics devices, micro fiber spinnerets, and bio-chips by the micro injection molding technique. His current research interest includes polymer processing.